Mr.Vance Liu | Solder Joint Reliability Awards | Best Researcher Award 

Wen-Ju (Vance) Liu is a seasoned professional in the field of materials science and engineering, currently serving as a Senior Package Characterization Engineer at Micron Technology Incorporation. Holding a Master of Engineering degree from the prestigious Whiting School of Engineering at Johns Hopkins University, Vance has cultivated a wealth of experience and expertise throughout his career.

His journey into the realm of materials science began with a Bachelor’s degree from National Cheng Kung University in Taiwan, where he demonstrated his academic prowess with an impressive GPA of 3.5 out of 4.0. Building upon this foundation, Vance pursued further education at Johns Hopkins University, engaging in fundamental research work at the Hopkins Extreme Materials Institute (HEMI) under the guidance of Professor Weihs.

 

Professional Profiles:

 

ORCID

 

🎓 Education

• Master of Engineering, Materials Science and Engineering, Whiting School of Engineering- Johns Hopkins University, Baltimore, MD (Jan 2017-May 2018)
• Bachelor of Engineering, Materials Science and Engineering, National Cheng Kung University (NCKU), Tainan, Taiwan (May 2016)
  • GPA: 3.5/4.0

💼 Work Experience

• Sr. Package Characterization Engineer, Micron Technology Incorporation (2023~present)
• Characterization Engineer, Micron Technology Incorporation (2019~2023)
  • Conducting material characterization and board-level reliability for NPI memory products.
  • Co-working with the technology development team on materials selection, 2nd sourcing, reliability, and thermal-mechanical performance enhancement.
  • Assisting in DRAM and NAND chip package integrity assessment for Taichung and Singapore sites.
• Summer Intern, Corning Asia Incorporation (2019)
  • Conducting research and simulation by incorporating cBN ceramics into new Iris glassR to improve transmittance value.
  • Filed and published the restricted technical report for cBN on Iris glassR forming process.
• Graduate Researcher, Hopkins Extreme Materials Institute (2018~2019)

🛠️ Technical/Lab Skills

• Programming Language: Matlab
• Computational Software: JMP, OriginLab, AutoCAD
• Lab Hardware & Skills: Tecnai Transmission Electron Microscope, JEOL-6700F Scanning Electron Microscope, MICROLAB 350 AES, ESCA, 2D X-ray Diffractometer, Atomic Force Microscopy (AFM), Equal Channel Angular Extrusion (ECAE), Wire-Cut EDM, Microscopes Raman Spectrometer, E-Beam Lithography, Spin-Coating, Sputter-Coating, Thin Film Processing

👨‍💼 Professional Activities

• Serving as IEEE Member (Electronic Packaging Society) since 2022
  • Awarded the IEEE-EPS certificate for young professionals in 2023.
• Serving as a technical reviewer for Springer and Elsevier journals since 2022
  • Journals include Journal of Materials Science: Materials in Electronics (IF: 2.8), Elsevier Memories, materials, devices, circuits, and systems, and Elsevier e-Prime-Advances in Electrical Engineering, Electronics, and Energy.

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