Prof. Alena Pletrikova | Solder joints

Posted on by Welding Conference
Prof. Alena Pletrikova : Solder joints

Technical University of Kosice, Slovakia

Congratulations, Prof. Alena Pletrikova, on winning the esteemed Best Researcher Award from ScienceFather! Your dedication, innovative research, and scholarly contributions have truly made a significant impact in your field. Your commitment to advancing knowledge and pushing the boundaries of research is commendable. Here’s to your continued success in shaping the future of academia and making invaluable contributions to your field. Well done!

Prof. Alena Pletrikova , a distinguished academic and researcher in the field of renewable energy, holds a Head of the Department of Technologies in Electronics from Technical University of Kosice, Slovakia. His academic journey has been marked by a profound dedication to advancing solar energy technologies, specifically in solar thermal harvesting and its integration into welding  and architectural applications.

Professional Profiles:

Experience and abilities:

 Supervisor of 10 PhD students (Urbančík – 2004, Bujaloboková – 2006, Ďurišin – 2009, Kravčík – 2012, Ruman – 2015, Rovenský – 2016, Lukács – 2017, Girašek – 2018, Lenger – 2021, Dzivý – 2023)
 Number of scientific publications: 337, 6 patents, 5 monographs, 27 publications in Current Content Journals, 396 SCI citations, WOS HI 10.
 Participation in more than 30 various research projects,
 Participation on COST-MP0602, Advanced Solder Materials for High Temperature Application-HISOLD
 Coordinator of Leonardo da Vinci: (project Agreement N° 2004 -146 157)
 Coordinator of APVT-20-014502 “Environmental processing of serpentine ore dump containing carcinogenic asbestos particles and unconventional utilization of produced substances “,

 publications:

[1] PIETRIKOVÁ, A., KAPUŠANSKÁ, E.: Production of Fine Copper Powder and Control of its
Properties, In: Transactions of the Technical University of Košice, England, 1991, pp. 245 -255

[2] PIETRIKOVÁ, A., SLOSARČÍK, S.: Mechanical Properties of Bent Modules Based on LTCC
Ceramics, In: Iranian Journal of Electrical and Computer Engineering, Vol. 1, No.1. Winter –
spring 2002, pp. 47-50, ISSN 1682-0053.

[3] GABÁNI, S., PAVLÍK, V., FLACHBART, K., VARGA, J., PIETRIKOVÁ, A.: RuO2 Based Low
Temperature Sensors with „Tuned“ Resistivity Dependencies, In: Czechoslovak Journal of
Physics, Vol. 54, 2004, Suppl. D, CZYPAO 54 (D), D1 – D700 (2004), ISSN 0011-4626, D663 –
D666.

[4] Mechanical properties of bent modules based on LTCC / Alena Pietriková, Stanislav Slosarčík –
2002.In: Iranian Journal of Electrical and Computer Engineering. Vol. 1, no. 1 (2002), p. 47-50. –
ISSN 1682-0053 Spôsob prístupu: http://www.ijece.org.

[5] RuO2-based low temperature sensors with “tuned” resitivity dependences / S. Gabáni … [et
al.] – 2004.In: Czechoslovak Journal of Physics. Vol. 54, Suppl. D, Part 2 (2004), p. D663-D666. –
ISSN 0011-4626 [GABÁNI, Slavomír – PAVLÍK, V. – FLACHBART, Karol – VARGA, Jaroslav –
PIETRIKOVÁ, Alena

Soldering Surface Modification Inspection

Posted on by Welding Conference

Introduction of Soldering Surface Modification Inspection

The synergy of Soldering, Surface Modification, and Inspection research forms a comprehensive exploration of the intricate processes involved in electronics manufacturing and materials joining.
Solder Alloy Development for Enhanced Performance:

This subfield concentrates on the formulation of advanced solder alloys. Researchers explore the composition of solders to improve melting points, wetting characteristics, and overall reliability of solder joints, contributing to the optimization of electronic assembly processes.

Surface Modification Techniques for Solder Wetting:

Surface modification plays a crucial role in ensuring proper solder wetting and adhesion. This subtopic delves into innovative surface modification techniques, such as plasma treatment and coatings, aiming to enhance the wettability of solder on various materials and promote reliable interconnections.

Inspection Methods for Solder Joint Reliability:

Researchers focus on developing advanced inspection techniques to assess the reliability of solder joints. This subtopic includes the exploration of non-destructive methods, such as X-ray imaging and acoustic microscopy, to detect defects, voids, and other issues that might compromise the performance of soldered electronic assemblies.

Reliability Testing of Solder Joints under Harsh Conditions:

This subfield investigates the resilience of solder joints under extreme conditions. Researchers aim to simulate harsh environments, such as temperature variations and mechanical stress, to assess the long-term reliability of soldered connections, ensuring robust performance in challenging operational conditions.

Nano-Soldering and Surface Modification at the Nanoscale:

With the trend toward miniaturization in electronics, this subtopic explores soldering and surface modification processes at the nanoscale. Researchers investigate techniques for precise soldering in microelectronics and nanotechnology applications, ensuring the integrity of connections in increasingly compact electronic devices.

 

Soldering Surface Modification Inspection

Posted on by Welding Conference

Introduction of Soldering Surface Modification Inspection

The synergy of Soldering, Surface Modification, and Inspection research forms a comprehensive exploration of the intricate processes involved in electronics manufacturing and materials joining.
Solder Alloy Development for Enhanced Performance:

This subfield concentrates on the formulation of advanced solder alloys. Researchers explore the composition of solders to improve melting points, wetting characteristics, and overall reliability of solder joints, contributing to the optimization of electronic assembly processes.

Surface Modification Techniques for Solder Wetting:

Surface modification plays a crucial role in ensuring proper solder wetting and adhesion. This subtopic delves into innovative surface modification techniques, such as plasma treatment and coatings, aiming to enhance the wettability of solder on various materials and promote reliable interconnections.

Inspection Methods for Solder Joint Reliability:

Researchers focus on developing advanced inspection techniques to assess the reliability of solder joints. This subtopic includes the exploration of non-destructive methods, such as X-ray imaging and acoustic microscopy, to detect defects, voids, and other issues that might compromise the performance of soldered electronic assemblies.

Reliability Testing of Solder Joints under Harsh Conditions:

This subfield investigates the resilience of solder joints under extreme conditions. Researchers aim to simulate harsh environments, such as temperature variations and mechanical stress, to assess the long-term reliability of soldered connections, ensuring robust performance in challenging operational conditions.

Nano-Soldering and Surface Modification at the Nanoscale:

With the trend toward miniaturization in electronics, this subtopic explores soldering and surface modification processes at the nanoscale. Researchers investigate techniques for precise soldering in microelectronics and nanotechnology applications, ensuring the integrity of connections in increasingly compact electronic devices.